Originally Posted by Funklord
Nice guide, but a few questions:
What if the parts are loose entirely?
How can one get the pads aligned without an x-ray machine or pick&place system?
Is the same procedure possible to do on components with plastic packages (such as large flash memory on bga etc.) ?
wait, what? there are no loose parts on the motherboard... if you have loose parts, that means they are detaching, and that's not good... when you do a reflow you don't detach anything, you heat the solder beads that you already have so that it melts and the cracks close. if you want to detach the chips, put new beads and resolder the chips, that's a reballing, and it needs a professional tool to be done...