Originally Posted by Nichibotsu
wait, what? there are no loose parts on the motherboard... if you have loose parts, that means they are detaching, and that's not good... when you do a reflow you don't detach anything, you heat the solder beads that you already have so that it melts and the cracks close. if you want to detach the chips, put new beads and resolder the chips, that's a reballing, and it needs a professional tool to be done...
Let's say the damage has occurred due to physical shock, and the parts have fallen off. The solder is still there, although damaged. Would repairing this *require* the cleaning & reballing procedure?