Hi to all, this is my first post here but i felt like saying something.
Thanks the author for its sincere attempt to teach us something here
but.. my advise is DONT try this..
The reasons are:
1. To attempt this you have to have 2 heat sources. 1 at the bottom and 1 at the top
You have to heat up all the motherboard evenly first at some degrees so that you dont warp it. We are playing with milimeters here and the slightest warp would be devastating.
to do that you have to have decent equipment and decent temperature control so you need at least 1000 euros machines
2. Reflowing means you heat the old solder and glue the detatched solder spots. The solder that sony used(and pretty much all companies now) is an environmental solder that heats up at around 220 degrees celcium. That solder if you want to mean business you have to remove it and put instead the tratitional solder that heats up at around 190 degrees and it makes much much better bonding and more stable contacts.
so.. you have to make a reballing instead. You remove the old solder balls and put the new ones. We are talking about i dont know maybe 600 balls that are tiny small. So again you need special machines. Thats why if you dont do it this way your ps3 will probably work for maybe a week, a day, an hour or maybe a month but later will surely brake again
3. You really dont know what the problem is. 90% will be the gpu. 0.1% will be the cpu so you dont mess the cpu never. But the YLOD means general hardware problem that means maybe its the ram, the power supply, the drive, one wire, you never know. You get the picture? Its a long shot.
Again my opinion leave it for the experts
And again thanks the author for he is trying but this guide is no good. Dont do this