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Old 11-30-2011   #31
Jitsuryoku
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Originally Posted by Herman View Post
the BGA connections that eventually crack due to constant heating and cooling cycles causing thermal stress in the lead free alloy which is used at the factory.
Well this kind of was my point -_-;... by the factory default design it isn't supposed to heat up to temperature which would effect the joints in any way. Heat above expectation of designers = overheating. But if you're an Electronics engineer you should know better..

Would you happen to know how to safely re-attach tracks that got lift (torn) upwards a bit?
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