PS3Hax Network - Playstation 3 Hacks and Mods - View Single Post - Adding temp sensor, what should I set the alarm at?

RIP-Felix · 09-24-2012

Stiltz85:
A word of caution. Use distilled water or even better use glycerine. Don't forget to add a fluid stabilizer that prevents mold, or change the fluid regularly. Change your hoses every 2 yrs to prevent cracking. Careful about combining two different types of metal in the system so as to avoid pitting. With a liquid cooling solution I would be more worried about the potential for a leak than the YLOD. You probably have done your reasearch if you are already moving forward. So I expect you know what I am talking about. Be sure you can't get away with another solution, and be careful, ok. It's your system though, have fun with it.

I wonder if anyone has tried adding TECs between the chips and heatsink. as long as they can pull away heat as fast as the chips can produce it, they could theoretically keep the temperatures at ambiant, with the right electronics and programming. Oh, I feel a google quest coming on...
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Found some good info. Definatly would want to keep the temp aboave ambiant because of the potential for condensation, of course. The size of the TEC would need to be smaller than the chip it is cooling. That way there is no overhang that could get below ambient. You would need a temp probe close to the cooling side to be sure it doesn't get below ambiant, and need to buffer the set piont so it never does, even if your reading is off by a few degrees. Because these things are not that efficient you would need a better heatsink for the heating side capable of handling the extra heat. Lastly you would need an automatic voltage conrtoller that supplies more or less power to the TEC as needed to maintain a set point temperature. Assuming all of this were possable it would be the most ideal cooling solution for this type of solder connection. It would effectively reduce the thermal stress to a minamal level. the heatsink would change in temperature not the chip and therefor the solder connections. No more YLOD. Again if a TEC small and powerful enough exists, then you would have to come up with an electronic solution for the voltage control (Maybe an arduino, I would have to talk to a friend who does that sort of thing).

09-24-2012	#8
RIP-Felix Apprentice Join Date: Sep 2012 Posts: 19 Likes: 0 Liked 2 Times in 2 Posts Mentioned: 0 Post(s) Tagged: 0 Thread(s)	Stiltz85: A word of caution. Use distilled water or even better use glycerine. Don't forget to add a fluid stabilizer that prevents mold, or change the fluid regularly. Change your hoses every 2 yrs to prevent cracking. Careful about combining two different types of metal in the system so as to avoid pitting. With a liquid cooling solution I would be more worried about the potential for a leak than the YLOD. You probably have done your reasearch if you are already moving forward. So I expect you know what I am talking about. Be sure you can't get away with another solution, and be careful, ok. It's your system though, have fun with it. I wonder if anyone has tried adding TECs between the chips and heatsink. as long as they can pull away heat as fast as the chips can produce it, they could theoretically keep the temperatures at ambiant, with the right electronics and programming. Oh, I feel a google quest coming on... *********** [ - Post Merged - ] *********** Found some good info. Definatly would want to keep the temp aboave ambiant because of the potential for condensation, of course. The size of the TEC would need to be smaller than the chip it is cooling. That way there is no overhang that could get below ambient. You would need a temp probe close to the cooling side to be sure it doesn't get below ambiant, and need to buffer the set piont so it never does, even if your reading is off by a few degrees. Because these things are not that efficient you would need a better heatsink for the heating side capable of handling the extra heat. Lastly you would need an automatic voltage conrtoller that supplies more or less power to the TEC as needed to maintain a set point temperature. Assuming all of this were possable it would be the most ideal cooling solution for this type of solder connection. It would effectively reduce the thermal stress to a minamal level. the heatsink would change in temperature not the chip and therefor the solder connections. No more YLOD. Again if a TEC small and powerful enough exists, then you would have to come up with an electronic solution for the voltage control (Maybe an arduino, I would have to talk to a friend who does that sort of thing). Last edited by RIP-Felix; 09-24-2012 at 10:59 PM.