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#21 |
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To remove with more facilitates the HIS, you must warm it (not too much) with the heat gun to soften the resin which lies under
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#22 |
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You can not spread the thermal paste but add to the center of the chip and the thermal paste spread itself when put together ps3.
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#23 | ||
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this would be the first time i will be doing it, but i think should not practice it on a customer PS3.
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#24 |
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you can try this, take 40 mm. DIAMETER RUBBER DRIVE BELT FOR cassette decks and do as shown in this picture.[IMG]
[/IMG]
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#25 |
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I do not get it, what this should help me with
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#26 |
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problem with ps3 is that the chip in the middle of no pressure, you do like this and put more pressure on the heatsinks and ps3 is no longer overheating.
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#27 |
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That's crazy if the board has warped that much in that little space it would be ****ed all together
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#28 | |
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So what is the best to do rather than removing the HIS?
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#29 | |
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Its purpose is to remove the HIS to fix the thermal paste, if the thermal paste has deteriorated increased pressure of the heatsink is useless |
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#30 |
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*cough* IHS
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